H3C UniServer R6900 G5 Server
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R6900 G5 server features Enterprisegrade RAS make it a decent choice for core workload, virtualization Database, dataprocessing and highdensity computing application.
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Description
Highlights：High Performance High Reliability, High Scalability
New generation H3C UniServer R6900 G5 adopt a modular architecture to provide outstanding scalable capacity supporting up to 50 SFF drives include optional 24 NVMe SSD drives.
R6900 G5 server features Enterprisegrade RAS make it a decent choice for core workload, virtualization Database, dataprocessing and highdensity computing application.
H3C UniServer R6900 G5 utilizes the most recent 3rd Gen Intel®Xeon® Scalable processors. (Cedar Island),6 UPI Bus interconnection and DDR4 memory with 3200MT/s speed as well as Newgeneration PMem 200 series persistent memory to strongly lift the performance up to 40% compared with previous platform. With 18 x PCIe3.0 I/O slots to reach excellent IO scalability.
94%/96% power efficiency and 5～45℃ operating temperature provide users a TCO returns in a greener data center.
R6900 G5 is optimized for environments:
- Virtualization — Support multiple types of core workloads on a single server to simplify Infrainvestment.
- Big Data — Manage exponential growth of structured, unstructured, and semistructured data.
- Data warehouse/analysis — Query data on demand to help service decision
- Customer relationship management (CRM) — Help you to gain comprehensive insights into business data to improve customer satisfaction and loyalty
- Enterprise resource planning (ERP) — Trust the R6900 G5 to help you manage services in real time
- Highperformance computing and deep learning — Provide sufficient GPUs to support machine learning and AI applications
- The R6900 G5 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.
Features
Industrial-leading performance improves data center productivity
- 4 sockets of the 3rd Gen Intel®Xeon®Scalable
- Processors
- 9 x single-slot wide GPU modules or 3 x double-slot wide GPU
- 24 x Intel ® Optane™ DC Persistent Memory Module(PMem 200)
Favorable Scalability and flexibility
- Modular Design
- Flexible 50 sff Drives
- 24 x NVME+M.2+MicroSD
- 18 x full height PCI-E 3.0 Slots+1 OCP3.0 slot
Enterprise-grade RAS
- High RAS features
- Redundant Components
Effective Security Design
- TPM/TCM
- Chassis Intrusion Detection
- Silicon Root of Trust
Specification
| CPU | 4 x 3rd generation Intel® Xeon® Cooper Lake SP series (Each processor up to 28 cores and maximum 250W power consumption) |
| Chipset | Intel® C621A |
| Memory | 48 × DDR4 DIMM slots , maximum 12.0 TB* Up to 3200 MT/s data transfer rate and support for both RDIMM and LRDIMM Up to 24 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass) |
| Storage controller | Embedded RAID controller (SATA RAID 0, 1, 5, and 10) Standard PCIe HBA cards and storage controllers, depending on model |
| FBWC | 8 GB DDR4 cache, depending on model , support supercapacitor protection |
| Storage | Maximum Front 50SFF, Support SAS/SATA HDD/SSD Drives Maximum 24 front U.2 NVMe Drives SATA M.2 SSDs/2 × SD cards , depending on model |
| Network | 1 × onboard 1 Gbps management network port OCP 3.0 × 16 open slot to install 4 × 1GE copper ports/2 × 10GE/2 x 25GE fiber ports Standard PCIe 3.0 Ethernet Adapters PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet Adapter， |
| PCIe slots | 18 × PCIe 3.0 FH standard slots |
| Ports | VGA connectors (Front and Rear) and serial port(RJ-45) 6 × USB 3.0 connectors (2 front, 2 rear, 2 internal) 1 dedicated management connector |
| GPU | 9 × single-slot wide or 3 × double-slot wide GPU modules |
| Optical drive | External optical disk drive , Optional |
| Management | HDM (with dedicated management port) and H3C FIST, support LCD touchable smart model |
| Security | Intelligent Front Security Bezel * Support Chassis Intrusion Detection TPM2.0 Silicon Root of Trust Two-factor authorization logging |
| Power supply | Support 4 × Platinum 1600W*(supports 1+1/2+2 redundancy) , 800W –48V DC power supplies (1+1/2+2 redundancy) 8 × Hot swappable fans |
| Power consumption | Themaximumpowerconsumptionofthehostis655.2W(includingthemainboardandfanmodule,butexcludingoptionalcomponentssuchasCPUandmemory).Thepowerconsumptionvariesaccordingtodifferentconfigurations. |
| Standards | CE，UL , FCC，VCCI，EAC, etc. |
| Operating temperature | 5°C to 45°C (41°F to 113°F) The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device. |
| Dimensions (H × W × D) | 4U Height Without a security bezel: 174.8 × 447 × 799 mm (6.88 × 17.59 × 31.46 in) With a security bezel: 174.8 × 447 × 830 mm (6.88 × 17.59 × 32.67 in) |
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