H3C UniServer R6700 G3 Server

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H3C UniServer R6700 G3 utilizes the most recent 2nd generation Intel® Xeon® scalable processor. With 11 x PCIe3.0 I/O slot to reach excellent IO scalability. 94%/96% power efficiency and 5~45℃ standard Operating temperature Provide users with higher energy efficiency returns.

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Description

Design for High Reliability, High performance, High Density

New generation H3C UniServer R6700 G3 adopt a high density architecture to provide outstanding performance with 4 sockets and achieve high reliability and flexibility within only 2U rack. This model supports up to 26 SFF drives include optional 18 NVMe SSD drives. R6700 G3 server features Enterprise-grade RAS make it a decent choice for core workload,virtualization,Database,data-processing and high-density computing application.

H3C UniServer R6700 G3 utilizes the most recent 2nd generation Intel® Xeon® scalable processor. With 11 x PCIe3.0 I/O slot to reach excellent IO scalability. 94%/96% power efficiency and 5~45℃ standard Operating temperature Provide users with higher energy efficiency returns.

You can use the R6700 G3 to support the following services:

  • Virtualization — Support multiple types of workloads on a single server to save space
  • Big Data — Manage exponential growth of structured, unstructured, and semi-structured data.
  • Applications centered on storage — Remove I/O bottleneck and improve performance
  • Data warehouse/analysis — Query data on demand to help service decision
  • Customer relationship management (CRM) — Help you to gain comprehensive insights into business data to improve customer satisfaction and loyalty
  • Enterprise resource planning (ERP) — Trust the R6700 G3 to help you manage services in real time
  • Virtual desktop infrastructure (VDI) — Deploys remote desktop service to bring great office agility and enable telecommuting with any device anywhere anytime
  • High-performance computing and deep learning — Provide 3 dual-slot wide GPU modules in a 2U footprint, meeting the requirements of machine learning and AI applications
  • The R6700 G3 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.

Features

Industrial-leading performance improves data center productivity

  • 4 sockets of the recent Intel®Xeon®Scalable
  • Processors
  • 8 x single-slot wide GPU modules
  • 24 x Intel ® Optane™ DC Persistent Memory Module

Favorable Scalability and Rich combinations.

  • 26 x SFF Drives
  • 18 x NVMe Drives
  • 11 x PCI-E 3.0 Slots
  • 2U High-density rack

Enterprise-grade RAS

  • High RAS features
  • Redundant Components

Effective Security Design

  • TPM/TCM
  • Chassis Intrusion Detection

Specification

Computing4 × Intel® Xeon® Scalable processors

(Up to 28 cores and maximum 205 W power consumption)

Memory48 × DDR4 DIMMs, 6.0 TB (maximum)

(Up to 2933 MT/s data transfer rate and support for both RDIMM and LRDIMM)

(Up to 24 Intel ® Optane™ DC Persistent Memory Module.(DCPMM)

Storage controllerEmbedded RAID controller (SATA RAID 0, 1, 5, and 10)

Standard PCIe HBA cards and storage controllers (Optional)

FBWC8 GB DDR4-2133MHz
StorageMaximum Front 24SFF + rear 2SFF, Support SAS/SATA HDD/SSD Drives

Maximum 16 front UniBay Slots,Rear 2 x UniBay Slots,Support SAS/SATA/NVMe Drives

SATA M.2 SSDs (Optional)

2 × SD internal slots (Optional)

Network1 × onboard 1 Gbps management network port

2 × onboard 1 Gbps network port

Support sLOM 4 × 1GE copper ports or 2 × 10GE/2 x 25GE fiber ports, sLOM support NCSI function

Support Standard PCIe 3.0 Ethernet Adapters

Support 10/25/40/100GE/IB/OPA High-performance Ethernet Adapter,

Support FC-HBA SAN Adapter

PCIe slots11 × PCIe 3.0 slots (one dedicated slot for Ethernet adapter,6 x FH slots,8 x PCIe x16 slots)
PortsFront VGA connector

Rear VGA connector and serial port(RJ-45)

5 × USB 3.0 connectors (one at the front, two at the rear, and two in the server)

1 × USB 2.0 front connector

SFF Liquid Crystal Display Module (Optional)

GPU8 × single-slot wide GPU modules
Optical driveExternal optical disk drive (Optional)
ManagementHDM (with dedicated management port) and H3C FIST, Support LED/LCD screen*diagnostic panel
SecuritySupport Chassis Intrusion Detection

TPM2.0

Power supplyPlatinum 1600W(supports 1+1 redundancy) ,

800W –48V/336V DC power supplies (1+1 redundancy)

Hot swappable fans (supports redundancy)

StandardsCE,UL , FCC,VCCI,EAC, etc.
Operating temperature5°C to 45°C (41°F to 113°F)

The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.

Dimensions (H × W × D)2U Height

Without a security bezel: 87.5 × 445.4 × 748 mm (3.44 × 17.54 × 29.45 in)

With a security bezel: 87.5 × 445.4 × 769 mm (3.44 × 17.54 × 30.28 in)

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