H3C UniServer R4700 G5 Server

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H3C UniServer R4700 G5 server is a H3C self-developed mainstream 1U rack server.

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Description

Highlights: High Performance High efficiency

New generation H3C UniServer R4700 G5 provide outstanding performance within 1U rack by adopting the latest Intel® X86 platform as well as several optimization for modern data center. Industrial-leading manufacturing process and system design enable customers to easily and reliably manage their IT infrastructure.

H3C UniServer R4700 G5 server is a H3C self-developed mainstream 1U rack server.

R4700 G5 utilizes the most recent 3rd Gen Intel®Xeon® Scalable processors and 8 channel DDR4 memory with 3200MT/s speed to strongly lift the performance up to 52% compared with previous platform.

Data Center Level GPU and NVMe SSD also equip with excellent IO scalability.

Maximum 96% power efficiency and 5~45℃ operating temperature provide users a TCO returns in a greener data center.

R4700 G5 is optimized for environments:

General workloads in high density data center — middle to large enterprise or cloud server provider.

Flexible Workloads — Database, Virtualization, Private Cloud, Public Cloud.

Computing Intensive architecture — Big Data, Business Intelligence, Geographical Exploration and Research.

Low-latency Transaction Applications — Online interactive transaction system in finance industry.

The R4700 G5 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.

Features

Industrial-leading performance improves data center productivity

  • Support up to 80 cores and 6TB memory
  • 16 x Intel ® Optane™ DC Persistent Memory Module(PMem 200)
  • Support 4 High-performance GPU

Favorable Scalability and flexibility

  • At most 12 Drives bays includes 8 x NVMe/SAS/SATA bays
  • 4 x PCI-E 4.0 Slots+1 OCP3.0 slot

Effective Security Design

  • TPM/TCM
  • Chassis Intrusion Detection
  • Silicon Root of Trust

Friendly interactive management Module

  • 1U LCD touchable smart management module

Specification

Detailed Specification
CPU2 x 3rd generation Intel® Xeon® Ice Lake SP series

(each processor up to 40 cores and maximum 270W power consumption)

ChipsetIntel® C621A
Memory32 x DDR4 DIMM slots , maximum 6.0 TB

Up to 3200 MT/s data transfer rate RDIMM

Up to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass)

Storage controllerEmbedded RAID controller

Standard PCIe HBA cards and storage controllers,depending on model

FBWC8 GB DDR4 cache, depending on model ,support supercapacitor protection
StorageUp to Front 4LFF bays, Rear 2SFF bays*

Up to Front 10SFF bays, Rear 2SFF bays*

Front SAS/SATA HDD/SSD/NMVe Drives, maximum 8 x U.2 NVMe Drives

SATA/PCIe M.2 SSDs,2 x SD card kit , depending on model

Network1 x onboard 1 Gbps management network port

1 x OCP 3.0 slot for 4 x 1GE or 2 x 10GE or 2 x 25GE NIC

PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet adapter,

PCIe slots4 x PCIe 4.0 standard slots
PortsVGA connectors (Front and Rear) and serial port (RJ-45)

5 x USB 3.0 ports (1 front, 2 rear, and 2 internal)

1 dedicated management Type-C port

GPU4 x single-slot wide GPU modules
Optical driveExternal optical disk drive,optional
ManagementHDM OOB system (with dedicated management port) and H3C iFIST/FIST, support LCD touchable smart model
SecurityIntelligent Front Security Bezel *

Chassis Intrusion Detection

TPM2.0

Silicon Root of Trust

2FA for HDM

Power supply2 x Platinum 550W/800W/850W/1300W/1600W (1+1 redundancy) ,depending on model

800W –48V DC power supply (1+1 Redundancy)

Hot swappable redundant fans

StandardsCE,UL , FCC,VCCI,EAC, etc.
Operating temperature5°C to 45°C (41°F to 113°F)

The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.

Dimensions (H × W × D)1U Height

Without a security bezel: 42.9 x 434.6 x 780 mm (1.69 x 17.11 x 30.71 in)

With a security bezel: 42.9 x 434.6 x 808 mm (1.69 x 17.11 x 31.81 in)

*The options may be different depending on the specific requirement, refer to related user guide for detail

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