Showing 25–31 of 31 results
Key Applications Virtualization HPC Cloud Computing High End Enterprise Server Software Defined Storage Application Tier Service Provider 5G/Telco Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 2 PCIe 4.0 x16 (FH, 10.5″L) Key Applications Virtualization HPC Cloud Computing High End Enterprise Server Software Defined Storage Application Tier Service Provider 5G/Telco Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series Flexible networking options
Key Applications Virtualization HPC CDN, Edge Nodes Cloud Computing Data Center Optimized Storage Headnode Key Features
Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 350W TDP Intel® C741 Chipset 16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz Dual AIOM (OCP 3.0) for networking (NCSI available), 1 dedicated IPMI LAN 10x front hot-swap 2.5″ SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card Key Applications Virtualization Cloud Computing Data Center Optimized Database/Storage Entry GPU server Key Features
Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 300W TDP Intel® C741 Chipset 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN 10x front hot-swap 2.5″ SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card Key Applications Virtualization Cloud Computing Data Center Optimized Entry GPU server Value IaaS Key Features
Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 300W TDP Intel® C741 Chipset 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN 4x front hot-swap 3.5″ SATA3 drive bays, SAS3 with additional SAS controller card Redundant Now Titanium 860W Power Supplies
Key Applications Cloud Computing Data Center Optimized Network Appliance AI inferencing, ML training Database/Storage Key Features
Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 350W TDP Intel® C741 Chipset 16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz Single AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 12x front hot-swap 3.5″ SATA3 drive bays (Optional 2 hybrid Gen5 NVMe), SAS3 with additional SAS controller card Key Applications Data Center Optimized Network Appliance Database/Storage Entry GPU server Key Features
Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 300W TDP Intel® C741 Chipset 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN 8x front hot-swap 3.5″ SATA3 drive bays (Optional 4 hybrid Gen5 NVMe), SAS3 with additional SAS controller card Redundant Now Titanium 1000W Power Supplies 
